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PERFORMANCE PCB PRODUCTION
PERFORMANCE PCB PRODUCTION
The best choices for the safety of your PCBs.
A SUITABLE PRODUCTION LINE
A SUITABLE PRODUCTION LINE
We know the capability and efficiency of our production partners. Each one is selected used following a dynamic vendor rate, ensuring you the best performance only.
CO-DESIGN & MATERIALS
CO-DESIGN & MATERIALS
We pay attention to the DFM of your new projects and analyze the layout structure to prevent criticism before production. We homologate base materials in our lab to measure their main features (Tg,CTE,TD,WA…) before producing PCBs.
IPC CLASS III PLATING
IPC CLASS III PLATING
We apply IPC class III hole plating process. This is the best solution to increase PCBs reliability and reduce any risk during soldering processes and field application.
CAPABILITY
CAPABILITY
Right experience to match PCB technology and volume to the suitable production line.
LOGISTIC FLEXIBILITY
LOGISTIC FLEXIBILITY
We are open to satisfy all your needs regarding incoterms conditions, delivery terms, warehouse stock.
WIP
WIP
We constantly check the progress of your orders daily, using a property system. You too can follow the order placed by using our online reserved platform.
INCOMING
INCOMING
We thoroughly check all incoming production batches before shipment. Our employees are located in the main production factories to supervise each processes steps. In our Shenzhen lab we extensively analyze a sample of each batch produced, following a dedicated inspection flow.
SINGLE AND DOUBLE SIDES
SINGLE AND DOUBLE SIDES
Material used
FR4 – FR4 Tg Low, Mid, High – CTI 175-249 PLC = 3) – TEFLON, FR4 low Er (for RF), FR4 ceramics
Laminates Halogen Free
Thickness of base PCB (including copper when> 0.8mm)
Standard 1,6 mm – To request from 0,5 to 5 mm
Panel Max. Dimension
1200 mm
Thickness of base copper
Standard (18um, 35um, 70um), Advanced (9um, 12um, 105um, 140um, 170um, 210um)
Surface Finishes
Passivated Copper OSP – Hot Air Levelling Lead Free or Sn/Pb
Immersion Silver – Immersion Tin
Hole Copper Plating
25um (average) – 20um (min. point)
NO X OUT
MULTILAYER
MULTILAYER
Material used
FR4 – Laminates HTC (High Thermal Conductivity) – Teflon – FR4 ceramics
FR4 Tg Mid, High – FR4 low Er and low Lf – Laminates Halogen Free
Thickness of base PCB (including copper when> 0.8mm)
Standard 1,6 mm – To request from 0,5 to 5 mm
Prepreg
To request
Thickness of base copper
Standard (18um, 35um, 70um), Advanced (9um, 12um, 105um, 140um, 170um, 210um)
Drilling
Mechanics (minimum drill d=0,20mm), mechanical controlled height
Laser via (max Ø laser via 0,1mmm – aspect ratio 1:1), blind and buried, for lay up sequential (HDI)
Surface Finishes
Passivated Copper OSP – HAL Lead Free or Sn/Pb – Electrolytic gold
Immersion Gold (ENIG) – Silver or Immersion Tin
Max. number of layer: 24
NO X OUT
FLEX E RIGIDFLEX
FLEX E RIGIDFLEX
Materiali utilizzabili
Polymide (e/o Kapton) – FR4 Tg Mid, High – FR4 a bassa Er – Laminati Halogen Free (only Rigid version)
Basic flex thickness
0.1mm min
Thickness of base copper
9um, 12um, 18um, 35um, 70um
Surface Finishes
Passivated Copper – ENIG
Hole Copper Plating:
25um (average) – 20um (min. point) – Rigid
12um (average) – 10um (min. point) – Flex)
NO X OUT
ALUMINUM PCB
ALUMINUM PCB
Material used
IMS (Insulated Metallic Substrate)
Manufacturer
Ventec – Deja – CSEM – ZHNM
PCB Type
Single Layer – Dual layer
Metal Thickness
0,6 – 1,0 – 1,5 – 2,0 – 3,0 mm
Insulation Thickness
50um – 75um – 100um – 125um – 150um
Temperature Coefficient
0,8 – 1,0 – 1,2 – 1,4 – 2,0 – 3,0 – 4,0 W/m°K
Base copper thickness
18um – 35um – 70um – 105um – 140um – 170um – 210um
Surface Finishes
Passivated Copper – ENIG – HAL Lead Free o Sn/Pb
NO X OUT
HIGH DISSIPATION PCB
HIGH DISSIPATION PCB
Material used
CEM3 e FR4 HTC (High Thermal Conductivity)
Produttori materiale di base
Panasonic – Nanya – Isola – Shengi
PCB Type
Single Layer – Double Layer – Multilayer
Temperature Coefficient
0,8 – 1,0 – 1,5 W/m°K
Thickness of base copper
18um – 35um – 70um (only FR4)
Surface Finishes
Passivated Copper – Hot Air Levelling Lead Free or Sn/Pb – ENIG – Electrolytic gold – Immersion Silver – Chemical Tin
NO X OUT
Il nostro potere di acquisto di oltre 230,000,000 dollari ti offre:
Migliori condizioni di acquisto
Migliori condizioni di acquisto
Ai tuoi ordini è assegnata la massima priorità durante la produzione e allo stesso tempo ti vengono offerte le migliori condizioni possibili.
Un’ampia gamma di PCB che copre l’intero ciclo di vita del prodotto
La nostra presenza, che comprende 16 aziende locali, ti offre:
Comunicazione proattiva e costante
Comunicazione proattiva e costante
Conoscenza dei tuoi prodotti e delle tue esigenze alle tue condizioni.
Elevata disponibilità con competenza e supporto commerciale e tecnico a livello locale.
Il nostro team di Factory Management composto da 83 specialisti ti offre:
Massime prestazioni degli stabilimenti
Massime prestazioni degli stabilimenti
Stabilimenti selezionati meticolosamente e impiegati solo per le tecnologie in cui eccellono.
Presenza di nostro personale negli stabilimenti che offre assicurazione di qualità proattiva e consegne puntuali.
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